Bond-on heatsinks for leadless chip carriers and flat-packs., Primarily designed for 68-pin devices. Suitable for high-power LEDs, Do użytku z = BGA, Wysokość = 9.14mm, Wymiary = 25.4 Dia. x 9.14mm, Oporność termiczna = 25.9°C/W, Średnica = 25.4mm, Kolor