Bond-on heatsinks for leadless chip carriers and flat-packs., Primarily designed for 68-pin devices. Suitable for high-power LEDs, Do użytku z = BGA, Wysokość = 9.14mm, Wymiary = 28.58 Dia. x 9.14mm, Oporność termiczna = 23.4°C/W, Średnica = 28.58mm, Kolo