Bond-on heatsinks for leadless chip carriers and flat-packs., Primarily designed for 68-pin devices. Suitable for high-power LEDs, Do użytku z = BGA, Wysokość = 17.65mm, Wymiary = 31.75 Dia. x 17.65mm, Oporność termiczna = 18.8°C/W, Średnica = 31.75mm, Ko