SRBP-paper FR2 1.5mm, solder-lacquered. EPOXY fibre-glass FR4 1.5 mm, hot air levelled (HAL-leadfree). Board size 100 x 160 x 1.6mm. Hole layout 37 x 57. Hole dia 1.0mm. Pitch 2.54mm (0.1in). Copper thickness 35µm, Materiał podstawy = Laminat z tkaniny i